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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12742059 B1

PDFFull Text
Date of Patent:
Sep. 22, 2026

Filed:

Aug. 15, 2025

Curable film composition, curable film, and cured product thereof

Applicant:

Thintronics, Inc., Alameda, CA (US);

Inventors:

Stefan Pastine, Alameda, CA (US);

Yaroslav Klichko, Alameda, CA (US);

Assignee:

THINTRONICS, INC., Alameda, CA (US);

Attorney:

Element IP, PLC

Primary Examiner:

Sheeba Ahmed

Int. Cl.
CPC ...
C08L 9/00 (2006.01); C08J 3/28 (2006.01); C08J 5/18 (2006.01); C08K 3/36 (2006.01); C08K 5/14 (2006.01); C08K 7/28 (2006.01); C08L 53/02 (2006.01); C08L 79/08 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 9/00 (2013.01); C08J 3/28 (2013.01); C08J 5/18 (2013.01); C08K 3/36 (2013.01); C08K 5/14 (2013.01); C08K 7/28 (2013.01); C08L 53/02 (2013.01); C08L 79/085 (2013.01); H05K 1/0373 (2013.01); C08J 2309/00 (2013.01); C08J 2353/02 (2013.01); C08J 2379/08 (2013.01); C08J 2409/00 (2013.01); C08J 2471/02 (2013.01); C08J 2479/08 (2013.01); C08K 2201/005 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01);
Abstract

A composition for curable films, a curable film, and a cured product obtained by curing the curable film are disclosed. The curable film is one containing, as essential components, hollow glass microspheres and a rubber composition containing at least one diene-based rubber; or one containing fused silica and/or hollow glass microspheres, a rubber composition containing at least one diene-based rubber, and a toluene soluble maleimide resin. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.

Find Patent Forward Citations

Pastine, Stefan. (2026). Curable film composition, curable film, and cured product thereof (U.S. Patent No. 12742059). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12742059

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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