The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Sep. 18, 2023
Applicant:

Honda Motor Co., Ltd., Tokyo, JP;

Inventor:

Tomoya Yabu, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60R 19/48 (2006.01); G01L 1/26 (2006.01); G01L 5/00 (2006.01);
U.S. Cl.
CPC ...
B60R 19/48 (2013.01); B60R 19/483 (2013.01); G01L 1/26 (2013.01); G01L 5/0052 (2013.01);
Abstract

A sensor arrangement structure that makes a sensor tube easy to arrange is disclosed. The sensor arrangement structure includes a bumper beam; a shock absorber disposed in front of the bumper beam and having a groove; and a contact sensor including a sensor tube, in which the sensor tube is disposed between the bumper beam and the shock absorber, the groove is configured to arrange the sensor tube, the groove includes an expansion groove portion, and the expansion groove portion has a width greater than a width of a rest part of the groove.


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Yabu, Tomoya. (2026). Bumper impact pressure sensor (U.S. Patent No. 12741606). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12741606

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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