The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Mar. 22, 2022
Applicant:
Jfe Steel Corporation, Tokyo, JP;
Inventors:
Soichi Fujimoto, Tokyo, JP;
Yasuhide Oshima, Tokyo, JP;
Assignee:
JFE Steel Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/082 (2006.01); B32B 15/09 (2006.01); B32B 37/06 (2006.01);
U.S. Cl.
CPC ...
B32B 15/082 (2013.01); B32B 15/09 (2013.01); B32B 37/06 (2013.01); B32B 2311/24 (2013.01); B32B 2311/30 (2013.01); B32B 2367/00 (2013.01); B32B 2369/00 (2013.01); B32B 2457/00 (2013.01);
Abstract
A film-laminated metal sheet satisfies smoothness, heat resistance, flexibility, and gas barrier properties and has a low environmental burden and excellent productivity and a method produces the metal sheet, a substrate for flexible electronics, and an organic EL substrate. The film-laminated metal sheet has at least one surface covered with a resin film. The arithmetic average roughness Sa of a surface of the resin film is 0.030 μm or less. The maximum peak height Sp of the surface of the resin film is 0.30 μm or less. The maximum valley depth Sv of the surface of the resin film is 1.0 μm or less.