The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Sep. 25, 2023
Applicant:
Posco Co., Ltd., Pohang-si, KR;
Inventors:
Seong-Woo Kim, Gwangyang-si, KR;
Jin-Keun Oh, Pohang-si, KR;
A-Ra Cho, Pohang-si, KR;
Hyeon-Jeong Shin, Pohang-si, KR;
Assignee:
POSCO CO., LTD, Pohang-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B21D 22/02 (2006.01); B21D 35/00 (2006.01); B21D 37/16 (2006.01); B32B 5/18 (2006.01); B32B 5/20 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); C21D 1/26 (2006.01); C21D 6/00 (2006.01); C21D 9/46 (2006.01); C21D 9/52 (2006.01); C22C 21/00 (2006.01); C22C 30/00 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/08 (2006.01); C22C 38/12 (2006.01); C22C 38/14 (2006.01); C22C 38/16 (2006.01); C22C 38/18 (2006.01); C22C 38/20 (2006.01); C22C 38/22 (2006.01); C22C 38/24 (2006.01); C22C 38/26 (2006.01); C22C 38/28 (2006.01); C22C 38/32 (2006.01); C22C 38/38 (2006.01); C22C 38/40 (2006.01); C22C 38/42 (2006.01); C22C 38/44 (2006.01); C22C 38/46 (2006.01); C22C 38/48 (2006.01); C22C 38/50 (2006.01); C22C 38/54 (2006.01); C22C 38/58 (2006.01); C22C 38/60 (2006.01); C22F 1/00 (2006.01); C22F 1/04 (2006.01); C23C 2/04 (2006.01); C23C 2/06 (2006.01); C23C 2/12 (2006.01); C23C 2/26 (2006.01); C23C 2/28 (2006.01); C23C 2/40 (2006.01); C23C 26/00 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); C23F 17/00 (2006.01);
U.S. Cl.
CPC ...
B32B 15/012 (2013.01); B21D 22/02 (2013.01); B21D 22/022 (2013.01); B21D 35/00 (2013.01); B21D 35/005 (2013.01); B21D 37/16 (2013.01); B32B 5/18 (2013.01); B32B 5/20 (2013.01); B32B 15/01 (2013.01); B32B 15/011 (2013.01); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C21D 1/26 (2013.01); C21D 6/005 (2013.01); C21D 6/008 (2013.01); C21D 9/46 (2013.01); C21D 9/52 (2013.01); C22C 21/00 (2013.01); C22C 30/00 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/008 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); C22C 38/18 (2013.01); C22C 38/20 (2013.01); C22C 38/22 (2013.01); C22C 38/24 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); C22C 38/32 (2013.01); C22C 38/38 (2013.01); C22C 38/40 (2013.01); C22C 38/42 (2013.01); C22C 38/44 (2013.01); C22C 38/46 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C22C 38/54 (2013.01); C22C 38/58 (2013.01); C22C 38/60 (2013.01); C22F 1/002 (2013.01); C22F 1/04 (2013.01); C23C 2/04 (2013.01); C23C 2/06 (2013.01); C23C 2/12 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/29 (2022.08); C23C 2/40 (2013.01); C23C 26/00 (2013.01); C23C 28/023 (2013.01); C23C 28/321 (2013.01); C23C 28/322 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C23F 17/00 (2013.01); Y10T 428/12479 (2015.01); Y10T 428/12757 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12951 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/12993 (2015.01);
Abstract
The present invention relates to a hot press formed member. A hot press formed member according to one aspect of the present invention comprises a steel sheet; and a plating layer on the steel sheet, wherein a number of voids per 1000 μmof an area from an interface between the plating layer and the steel sheet to 15 μm is zero and wherein a concentration gradient at a section having an Fe content of 45% to 80% in the plating layer in a thickness direction from a surface of the plating layer according to a result of GDS analysis is 7 wt %/μm or less.