The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Dec. 21, 2021
Applicants:

Kaneka Corporation, Osaka, JP;

Suntory Holdings Limited, Osaka, JP;

Inventors:

Hideyuki Suzuki, Tokyo, JP;

Takashi Akiyama, Tokyo, JP;

Masanori Nishiyama, Tokyo, JP;

Yoshiaki Matsuoka, Takasago, JP;

Nobuo Nakamura, Settsu, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/00 (2006.01); B29C 49/06 (2006.01); B29C 49/64 (2006.01); B29C 49/78 (2006.01); C08L 67/04 (2006.01);
U.S. Cl.
CPC ...
B29C 49/0005 (2013.01); B29C 49/6418 (2013.01); B29C 49/786 (2013.01); C08L 67/04 (2013.01); B29C 49/06 (2013.01); B29C 2049/7862 (2022.05); B29C 2949/0811 (2022.05);
Abstract

It is an object of the present invention to provide a novel production method which makes it possible to obtain a molded product containing a P3HB-based resin through an injection blow molding method and a technique for using such a method. The object is achieved by providing a method for producing a molded product containing a P3HB-based resin, the method including the steps of: (A) plasticizing a resin composition containing a P3HB-based resin; (B) subjecting the plasticized resin composition obtained in the step (A) to injection molding to obtain a preform; and (C) subjecting the preform obtained in the step (B) to blow molding to obtain a molded product.


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