The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Feb. 08, 2021
Applicant:
Zeon Corporation, Tokyo, JP;
Inventors:
Junji Kodemura, Tokyo, JP;
Misa Hayashi, Tokyo, JP;
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 41/14 (2006.01); B29C 41/36 (2006.01); B29C 41/52 (2006.01); C08F 255/00 (2006.01); C08L 13/02 (2006.01);
U.S. Cl.
CPC ...
B29C 41/14 (2013.01); B29C 41/36 (2013.01); B29C 41/52 (2013.01); C08F 255/00 (2013.01); C08L 13/02 (2013.01);
Abstract
A method for producing a dip-molded article, the method including steps of immersing a mold for dip molding in a coagulant solution to deposit the coagulant on the mold for dip molding; providing a latex composition containing a carboxy-modified conjugated diene polymer latex which is a dispersion of carboxy-modified conjugated diene polymer particles having a volume average particle size of 500 to 2,000 nm in water; and immersing the mold for dip molding having the coagulant deposited thereon in the latex composition to obtain a dip-molded article having a thickness of 0.02 to 0.19 mm.