The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Feb. 27, 2023
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Seiji Nakayama, Tokyo, JP;

Yuki Kimura, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/06 (2022.01); B22F 9/04 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
B22F 1/06 (2022.01); B22F 9/04 (2013.01); H01B 1/22 (2013.01); B22F 2009/043 (2013.01); B22F 2301/255 (2013.01); B22F 2304/00 (2013.01);
Abstract

A cuboid silver powder including silver particles having a BET specific surface area of 0.5 m/g or less. An average aspect ratio of the cuboid silver powder is 1.2 or greater and less than 2.0 as determined by observing cross-sections of 100 or more silver particles from the silver particles. An average of a ratio represented by (Formula 1) below is 0.84 or greater. The ratio is a ratio of perimeter of one silver particle among the silver particles to perimeter of a rectangle circumscribing the one silver particle. (Formula 1): L/(2×major axis+2×minor axis) where L is the perimeter (μm) of the one silver particle, and the major axis and minor axis are respectively a long side (μm) and short side (μm) of the rectangle of minimum area circumscribing an outline of cross-section of the one silver particle.


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