The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Nov. 16, 2023
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Michiyoshi Takano, Okaya, JP;
Assignee:
SEIKO EPSON CORPORATION, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/65 (2026.01); H10W 70/69 (2026.01); H10W 72/20 (2026.01);
U.S. Cl.
CPC ...
H10W 90/701 (2026.01); H10W 70/65 (2026.01); H10W 70/69 (2026.01); H10W 72/265 (2026.01); H10W 72/267 (2026.01); H10W 90/724 (2026.01);
Abstract
A semiconductor package includes: a silicon interposer; a photosensitive resin disposed at the silicon interposer and including an opening portion; metal wiring disposed at the photosensitive resin and at the silicon interposer in the opening portion; a first bump disposed at the metal wiring in the opening portion; a semiconductor chip disposed above the first bump and including a pad electrically coupled to the first bump; and a second bump disposed at the metal wiring in a region that overlaps the photosensitive resin in a plan view.