The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Jun. 26, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Seonho Lee, Suwon-si, KR;
Myoungchul Eum, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 72/30 (2026.01); H10W 74/15 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 72/354 (2026.01); H10W 74/15 (2026.01); H10W 90/722 (2026.01); H10W 90/732 (2026.01);
Abstract
A semiconductor package includes a buffer die, a first core die disposed on the buffer die, and a non-conductive film (NCF) disposed between the buffer die and the first core die so that the buffer die and the first core die are bonded to each other, wherein the NCF includes a dibenzocyclooctadiene (DBCOD)-based compound.