The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Apr. 16, 2024
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Yuji Morinaga, Saitama, JP;
Junya Yuguchi, Saitama, JP;
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Abstract
In a semiconductor module, first and third chips are disposed symmetrically with respect to a center line. Second and fourth chips are disposed symmetrically with respect to the center line. First and third wiring patterns are disposed symmetrically with respect to the center line. Second and fourth wiring patterns are disposed symmetrically with respect to the center line. Two intermediate points are disposed symmetrically with respect to the center line. Two second power terminals are disposed symmetrically with respect to the center line. A fifth wiring pattern and a first power terminal are disposed symmetrically with respect to the center line. The intermediate points are adjacent to each other on one side of the module. All power terminals are on the other side of the module. The first power terminal is above the fifth wiring pattern in a non-contact state and connects the first and third wiring patterns.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile