The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
May. 19, 2021
Applicant:
Ntt, Inc., Tokyo, JP;
Inventors:
Assignee:
NTT, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10P 72/70 (2026.01); H10W 70/60 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10P 72/74 (2026.01); H10W 70/611 (2026.01); H10W 74/114 (2026.01); H10W 90/00 (2026.01); H10W 90/401 (2026.01); H10W 74/10 (2026.01); H10W 90/756 (2026.01);
Abstract
A semiconductor device includes a first wiring layer, a first semiconductor chip, a second wiring layer, and a second semiconductor chip. In addition, in the semiconductor device, a molding resin layer that molds the first semiconductor chip on the first wiring layer and a molding resin layer that molds the second semiconductor chip on the second wiring layer are formed, and the molding resin layers are integrally formed through a through-hole.