The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Sep. 15, 2023
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Ranadeep Dutta, Del Mar, CA (US);
Jonghae Kim, San Diego, CA (US);
Je-Hsiung Lan, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/63 (2026.01); H10W 70/65 (2026.01); H10W 70/68 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/635 (2026.01); H10W 70/65 (2026.01); H10W 70/68 (2026.01); H10W 90/00 (2026.01); H10W 90/722 (2026.01); H10W 90/724 (2026.01);
Abstract
A package comprising an interposer comprising a silicon substrate comprising a porous portion; and a plurality of via interconnects extending through the porous portion of the silicon substrate. The package includes a first integrated device coupled to the interposer through a first plurality of solder interconnects.