The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Aug. 23, 2023
Ohkuchi Materials Co., Ltd., Isa, JP;
CHANG WAH TECHNOLOGY CO., LTD., Kaohsiung City, TW;
Abstract
A lead frame formed of a plate-shaped copper material, at least one surface of which being smooth, comprising: a predetermined connection plating layer being provided at a portion to be connected for conduction of a semiconductor element on the smooth surface of the plate-shaped copper material; a portion where the smooth surface of the copper material exposed in an annular shape being provided around the connection plating layer; and an anodic oxide film of the copper material being provided at other portions. With this composition, the lead frame of the present disclosure, without having a roughening relaxation area, may be suitable for connection by solder connection or die attach material in the portion to be connected for conduction of semiconductor elements, may have excellent adhesion with sealing resin when a semiconductor package is manufactured by resin sealing, and may be manufactured efficiently and at a low cost.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile