The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Jul. 05, 2023
Applicant:
Macronix International Co., Ltd., Hsinchu, TW;
Inventor:
Chin-Cheng Yang, Kaohsiung County, TW;
Assignee:
MACRONIX INTERNATIONAL CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 46/00 (2026.01); H10P 74/20 (2026.01); H10W 80/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 46/00 (2026.01); H10P 74/203 (2026.01); H10W 46/301 (2026.01); H10W 80/163 (2026.01); H10W 90/792 (2026.01);
Abstract
A semiconductor integrated circuit, a semiconductor device and a method for aligning semiconductor integrated circuits are provided. The semiconductor integrated circuit includes a substrate and an overlay mark structure in the substrate. The overlay mark structure includes first overlay marks and second overlay marks separated from each other. A first mark width of the first overlay marks is smaller than a second mark width of the second overlay marks.