The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
May. 11, 2023
Nxp B.v., Eindhoven, NL;
Mustafa Acar, Eindhoven, NL;
Paul Mattheijssen, Boxtel, NL;
Philipp Franz Freidl, Weurt, NL;
Rajesh Mandamparambil, Eindhoven, NL;
Jan Willem Bergman, Veghel, NL;
NXP B.V., Eindhoven, NL;
Abstract
An RF package assembly includes a stacked package-on-package arrangement of a first substrate and a second substrate. Each of the first and second substrates include RF signal pads and ground pads. An interface region between the stacked substrates couples the RF signal pads and ground pads of the first substrate to corresponding pads of the second substrate. The interface region includes galvanic connection regions providing a galvanic connection between the each of the first substrate ground pads and each of the corresponding second substrate ground pads. The interface region includes dielectric regions between each of the first substrate RF signal pads and the corresponding second substrate RF signal pads so that RF signals transmitted between the two substrates are capacitively coupled.