The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Feb. 27, 2024
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Yoshihito Otsubo, Nagaokakyo, JP;

Tsuyoshi Takakura, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H10W 42/20 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 42/20 (2026.01); H10W 74/114 (2026.01); H10W 90/754 (2026.01);
Abstract

A module includes: one or more electronic components and one or more pad electrodes disposed and aligned such that lower ends thereof are positioned on a reference surface; and a sealing resin disposed to seal the one or more pad electrodes and the one or more electronic components. A first surface serving as an upper surface and a second surface serving as a side surface of the sealing resin are covered with a shield film. A first wire and a second wire are disposed in the sealing resin to electrically connect the one or more pad electrodes and the shield film at a first point and a second point, respectively, that are selected from the first surface and the second surface. The first point and the second point are different in height when viewed from the reference surface.


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Otsubo, Yoshihito. (2026). Module (U.S. Patent No. 12740423). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12740423

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