The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Feb. 23, 2024
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Dietmar Spitzer, Völkermarkt, AT;

Tomas Reiter, Ottobrunn, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/25 (2026.01); H10W 70/65 (2026.01); H10W 76/12 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/258 (2026.01); H10W 70/65 (2026.01); H10W 76/161 (2026.01); H10W 90/00 (2026.01); H10W 90/701 (2026.01);
Abstract

An electronic device includes an enclosure, one or more power semiconductor dies within the enclosure, a supply terminal, and a thermal bridge. The supply terminal is electrically connected to the one or more power semiconductor dies and is at least partially exposed from the enclosure. The supply terminal extends lengthwise in a longitudinal direction and includes a constricted region where a width of the supply terminal reduces in a lateral direction transverse to the longitudinal direction. The thermal bridge is distinct from the enclosure. The thermal bridge bridges the constricted region and provides a thermal conduction path that is in parallel with a thermal conduction path of the supply terminal. The thermal bridge is non-magnetic and has a thermal conductivity that is higher than a thermal conductivity of the enclosure.


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