The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Nov. 20, 2023
Lx Semicon Co., Ltd., Daejeon, KR;
Deog Soo Kim, Daejeon, KR;
Tae Ryong Kim, Daejeon, KR;
LX SEMICON CO., LTD., Daejeon, KR;
Abstract
A stacked semiconductor module having a double-sided heat dissipation structure according to one aspect of the present invention in which semiconductor dies may be arranged in a stacked structure with a heat dissipation substrate interposed there-between. The heat dissipation substrate includes a first heat dissipation substrate; a second heat dissipation substrate disposed below the first heat dissipation substrate to face the first heat dissipation substrate. The stacked semiconductor module includes a first semiconductor die module mounted between the first heat dissipation substrate and the second heat dissipation substrate; a third heat dissipation substrate disposed below the second heat dissipation substrate to face the second heat dissipation substrate; and a second semiconductor die module mounted between the second heat dissipation substrate and the third heat dissipation substrate.