The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Jun. 23, 2023
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Reginald D. Bean, Center Point, IA (US);
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Abstract
An anti-fuse apparatus for enabling or disabling features associated with one or more integrated circuits (IC) set into a substrate includes a layer of low melting point dielectric material deposited above and/or between two conductive pads set into the substrate and not otherwise electrically coupled. A layer of a low melting point conductive alloy is deposited above the dielectric layer, and a layer of an energetic material deposited above the conductive alloy layer. The energetic material is connected to an ignition circuit for triggering a thermal reaction within the energetic material, removing the dielectric layer and melting the conductive alloy to electrically bridge the conductive pads, enabling or disabling features associated with the ICs (or providing tamper-proof identification strapping) without otherwise fracturing or damaging the underlying substrate or ICs set thereinto.