The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Apr. 13, 2023
Applicant:

Semes Co., Ltd., Chungcheongnam-do, KR;

Inventors:

Hee Jae Byun, Chungcheongnam-do, KR;

Kyo Bong Kim, Chungcheongnam-do, KR;

Chan Young Choi, Chungcheongnam-do, KR;

Wan Hee Jeong, Chungcheongnam-do, KR;

Sang Oh Kim, Chungcheongnam-do, KR;

Assignee:

SEMES CO., LTD., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 72/50 (2026.01); B25J 11/00 (2006.01); B25J 13/08 (2006.01); H10P 72/00 (2026.01); H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/53 (2026.01); B25J 11/0095 (2013.01); B25J 13/08 (2013.01); H10P 72/0606 (2026.01); H10P 72/7602 (2026.01);
Abstract

A method and apparatus for aligning a wafer using a laser scanner, and a semiconductor transfer device are provided. The method includes a laser irradiation operation of irradiating a laser toward the wafer using a laser scanner disposed on a rear side or a lower side of the wafer and obtaining an image, a dataset acquisition operation of obtaining location information of at least three wafer edges by using a distance corresponding to a laser irradiation direction to a wafer edge in the image, a calculation operation of calculating a center point of the wafer by using the obtained location information of the wafer edge, and a detection operation of detecting whether a calculated center point is within a preset tolerance range.


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