The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Aug. 06, 2021
Applicant:

Ams-osram International Gmbh, Regensburg, DE;

Inventors:

Andreas Leber, Regensburg, DE;

Christine Rafael, Weil Am Rhein, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H10H 20/013 (2025.01); H10H 20/0364 (2025.01);
Abstract

A component may include a semiconductor body, an insulation structure, and a connection structure. The semiconductor body may have a first semiconductor layer, a second semiconductor layer, and an active zone located therebetween. The connection structure may have a connection layer in direct electrical contact with the second semiconductor layer. The insulation structure may adjoin both the second semiconductor layer and the connection layer. The insulation structure may laterally surround and may partially cover the connection layer in top view. The connection structure may have through-contacts in electrical contact with the connection layer and along a vertical direction, which extend throughout the insulation structure. The component may have a back side formed as a mounting surface, which is structured and formed, at least in regions, by surfaces of the connection structure. The through-contacts may be formed as individual, one-piece contact columns or as integral parts of a continuous contact layer.


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