The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Jan. 21, 2022
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Naoki Komai, Kanagawa, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Abstract
The present technology relates to a semiconductor chip of an imaging element, a method of manufacturing the semiconductor chip, a semiconductor device, a method of manufacturing the semiconductor device, and an electronic device, which are capable of suppressing image quality deterioration of a captured image while securing long-term reliability after mounting of the substrate. The semiconductor chip includes a CMOS image sensor, a sealing resin formed on the CMOS image sensor, and a protective substrate bonded to the CMOS image sensor via the sealing resin. The sealing resin includes a base material and a reinforcing material having a Young's modulus or breaking strength higher than that of the base material. The present technology can be applied to, for example, a semiconductor chip of a CMOS image sensor or the like.