The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Apr. 02, 2024
Mitsubishi Electric Corporation, Tokyo, JP;
Takuya Yoshida, Fukuoka, JP;
Kazutoyo Takano, Fukuoka, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device includes: a semiconductor substrate including a device region and a dicing line region surrounding the device region; a front surface electrode provided on a front surface of the semiconductor substrate in the device region; a back surface electrode made of a metal and provided on a back surface opposite the front surface of the semiconductor substrate; a first silicide layer provided between the back surface and the back surface electrode in the device region; and a second silicide layer provided between the back surface and the back surface electrode in the dicing line region, wherein contact resistance between the first silicide layer and the semiconductor substrate is lower than contact resistance between the second silicide layer and the semiconductor substrate, and hardness of the second silicide layer is lower than hardness of the first silicide layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile