The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Jul. 02, 2024
Applicant:

Nintendo Co., Ltd., Kyoto, JP;

Inventors:

Takafumi Nishida, Kyoto, JP;

Kohei Matsumoto, Kyoto, JP;

Assignee:

NINTENDO CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 5/00 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20145 (2013.01); H05K 1/0209 (2013.01); H05K 5/0086 (2013.01); H05K 5/04 (2013.01); H05K 7/20154 (2013.01); H05K 7/20172 (2013.01);
Abstract

An electronic apparatushas: a housing having an intake opening; a fan and a board housed in the housing; and a first and second heat generating components mounted on a first and second surface of the board, respectively. A first and second flow paths guiding air flowing in from the intake opening to the fan are formed in the housing. The first flow path includes a space on the first surface having the first heat generating component, and the second flow path includes a space on the second surface having the second heat generating component. In a direction perpendicular to the board, a distance between the first surface and its facing surface is longer than a distance between the second surface and its facing surface. The heat amount generated by the first heat generating component is larger than the heat amount generated by the second heat generating component.


Find Patent Forward Citations

Loading…