The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Oct. 25, 2022
Nitto Denko Corporation, Osaka, JP;
Takahiro Ikeda, Osaka, JP;
Teppei Niino, Osaka, JP;
NITTO DENKO CORPORATION, Osaka, JP;
Abstract
A wiring circuit board includes a metal support board, a first metal thin film, an insulating layer, a second metal thin film, and a conductive layer in a thickness direction order. The insulating layer includes a through hole penetrating in the thickness direction, which includes a first opening end at the first metal thin film side, a second opening end opposite to the first opening end, and an inner wall surface between the first and second opening ends. The first metal thin film includes a first opening portion, which overlaps the first opening end in a projection view in the thickness direction. The second metal thin film includes a second opening portion, which overlaps the first opening portion and the second opening end in a projection view in the thickness direction. The conductive layer has a via portion disposed in the through hole and connected to the metal support board.