The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Sep. 01, 2023
Accenture Global Solutions Limited, Dublin, IE;
Tingyu Cheng, Atlanta, GA (US);
Taylor Tabb, San Francisco, CA (US);
Eric Michael Gallo, Moretown, VT (US);
Jung Wook Park, Foster City, CA (US);
Aditi Maheshwari, San Francisco, CA (US);
Lavinia Andreea Danielescu, Seattle, WA (US);
Luke Fabrice Gockowski, Oakland, CA (US);
ACCENTURE GLOBAL SOLUTIONS LIMITED, Dublin, IE;
Abstract
The present disclosure relates to electronic devices and methods of manufacturing electronic devices. A method of manufacturing a dissolvable electronic device includes forming a dissolvable sheet; applying a self-sintering agent to the dissolvable sheet to form a substrate; and depositing electrically conductive ink onto the substrate in a trace. A method of manufacturing a meltable electronic device includes mixing a conductive material with a melted wax to form a conductive wax mixture in liquid form; molding the conductive wax mixture; and solidifying the conductive wax mixture to obtain the meltable electronic device. A method of manufacturing an edible electronic device includes cutting a layer of conductive material to form a pattern that defines a circuit; applying the layer of conductive material to an edible medium, wherein the edible medium is in liquid or semi-solid form; and solidifying the edible medium to obtain the edible electronic device.