The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Oct. 09, 2023
Meta Platforms Technologies, Llc, Menlo Park, CA (US);
Brian Toleno, Cupertino, CA (US);
Michael Nikkhoo, Saratoga, CA (US);
Arman Boromand, Issaquah, WA (US);
Sheng Ye, Redmond, WA (US);
Andrew John Ouderkirk, Kirkland, WA (US);
Jonathan Robert Peterson, Woodinville, WA (US);
Meta Platforms Technologies, LLC, Menlo Park, CA (US);
Abstract
A thermoplastic interposer formed of ordered polymer sheets that may be configured to act as an interconnect and as a thermal energy spreader. In examples, the thermoplastic interposer may include one or more extensions or wings to further dissipate heat. In examples, laser direct structuring (LDS) may be used to form or more through silicon vias (TSVs) or through-chip vias. In examples, the ordered polymer sheets may be extruded via a roll-to-roll process, stacked, and processed to form a laminate interposer structure that makes up the interposer. In examples, the thermoplastic interposer may be used in multi-layer structures interconnecting two or more board assemblies such as printed circuit boards (PCB)s.