The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Dec. 20, 2023
Applicant:

Schneider Electric (China) Co., Ltd., Beijing, CN;

Inventors:

Zhibao Wang, Beijing, CN;

Baoyun Bi, Beijing, CN;

Xiaoqiang Li, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 7/205 (2013.01); H05K 7/20509 (2013.01); H05K 2201/062 (2013.01); H05K 2201/066 (2013.01);
Abstract

Embodiments of the present disclosure provides a heat dissipating assembly for a circuit, the circuit comprises a printed circuit board and a plurality of electronic components, the printed circuit board is provided with a plurality of first through holes for pins of the plurality of electronic components to pass through, the heat dissipating assembly comprises: a bracket connected to the printed circuit board, the bracket is provided with a second through hole for a respective pin to pass through at a position corresponding to each first through hole; a plurality of heat dissipating sheets each disposed against a pair of electronic components of the plurality of electronic components; and a plurality of limiting members each disposed adjacent to a side of the bracket away from the printed circuit board, to limit each pair of electronic components and a respective heat dissipating sheet to a predetermined position relative to the bracket.


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