The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Sep. 14, 2022
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventor:
Bart Kassteen, Helden, NL;
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H10W 40/00 (2026.01); H10W 40/22 (2026.01); H10W 42/20 (2026.01); H10W 70/68 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01); H10W 72/20 (2026.01); H10W 74/00 (2026.01); H10W 74/10 (2026.01); H10W 74/40 (2026.01);
U.S. Cl.
CPC ...
H03H 9/02102 (2013.01); H03H 3/08 (2013.01); H03H 9/02834 (2013.01); H03H 9/02913 (2013.01); H03H 9/02976 (2013.01); H03H 9/0542 (2013.01); H10W 40/037 (2026.01); H10W 40/228 (2026.01); H10W 42/20 (2026.01); H10W 70/68 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01); H10W 72/287 (2026.01); H10W 74/00 (2026.01); H10W 74/127 (2026.01); H10W 74/40 (2026.01); H10W 90/724 (2026.01);
Abstract
Disclosed are apparatuses and techniques for fabricating single or multi-die packages with sealed enclosures. In one or more aspects an apparatus includes a die; a perimeter metallization disposed on a perimeter of the die; a package substrate; and a seal coupled to the perimeter metallization and the package substrate, configured to seal the die to the package substrate.