The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Nov. 06, 2024
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Benjamin S. Ngu, Rochester Hills, MI (US);

Chandra S. Namuduri, Troy, MI (US);

Yilun Luo, Ann Arbor, MI (US);

Khorshed Mohammed Alam, Canton, MI (US);

Rashmi Prasad, Troy, MI (US);

Richard M. Nichols, III, Macomb, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 7/537 (2006.01); B60L 15/00 (2006.01); H02M 7/00 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H02M 7/537 (2013.01); B60L 15/007 (2013.01); H02M 7/003 (2013.01); H05K 7/14329 (2022.08); B60L 2210/40 (2013.01);
Abstract

A multi-phase power inverter for an electric propulsion system including a plurality of X-type multilevel power converters arranged as solid-state integrated circuits. Each X-type multilevel power converter includes a positive direct current (DC) power bus, a negative DC power bus, a first alternating current (AC) bus, a second AC power bus, a first clamping diode, a second clamping diode, a power module substrate disposed on an insulating substrate, and a heat sink adjacent to a first side of the insulating substrate. The power module substrate includes a plurality of semiconductor switches, each including a plurality of lateral semiconductor dies each having gate control terminals. The plurality of semiconductor switches, the first clamping diode, and the second clamping diode are coplanar, with the DC power terminals on one side of the X-type multilevel power converter, and the auxiliary and output terminals disposed on the opposite side.


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