The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Jun. 23, 2021
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventor:

Hisashi Sugie, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02P 31/00 (2006.01); H02K 11/27 (2016.01); H02P 21/22 (2016.01); H02P 27/06 (2006.01); H10W 70/40 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H02K 11/27 (2016.01); H02P 21/22 (2016.02); H02P 27/06 (2013.01); H10W 70/465 (2026.01); H10W 74/111 (2026.01);
Abstract

A semiconductor device includes a semiconductor chip on which a semiconductor integrated circuit is formed, a plurality of leads disposed around the semiconductor chip, chip-directed wires connecting leads to the semiconductor chip, and a package sealing those. The semiconductor integrated circuit senses a sensing target current flowing through a sense resistor based on the voltage drop across the sense resistor, and performs predetermined operation based on the sensing result. The plurality of leads include a first and a second lead connected to one end and the other end of the sense resistor. The sense resistor is formed using a sensing metal member connecting between the first and second leads within the package without passing via the semiconductor chip.


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