The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Mar. 01, 2023
Applicant:

Nichia Corporation, Anan, JP;

Inventor:

Hidenori Matsuo, Hadano, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02375 (2021.01); H01S 5/02208 (2021.01); H01S 5/02253 (2021.01); H01S 5/02315 (2021.01); H01S 5/02325 (2021.01); H01S 5/02355 (2021.01); H01S 5/0237 (2021.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02375 (2021.01); H01S 5/02208 (2013.01); H01S 5/02253 (2021.01); H01S 5/02315 (2021.01); H01S 5/02325 (2021.01); H01S 5/0237 (2021.01); H01S 5/02355 (2021.01); H01S 5/02469 (2013.01);
Abstract

A light-emitting device includes a semiconductor laser element, a base, a cover, and two lead terminals. The base has a bottom portion supporting the semiconductor laser element and a lateral wall surrounding the semiconductor laser element with the lateral wall being bonded to the bottom portion. The lateral wall includes a light-transmitting portion configured to transmit a laser beam emitted from the semiconductor laser element. The cover and the base together define an encapsulation space in which the semiconductor laser element is encapsulated. The two lead terminals penetrate through the lateral wall of the base, one end of each of the lead terminals being located inside the encapsulation space. The bottom portion of the base has an upper surface defining a recessed portion located between the two lead terminals as viewed from above. The recessed portion has a flat bottom surface over which the semiconductor laser element is placed.


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