The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Jul. 05, 2022
Applicant:

Sika Technology Ag, Baar, CH;

Inventors:

Robert Witt, Rodgau, DE;

Marko Vidovic, Frankenthal, DE;

Frederick Schwab, Frankfurt, DE;

Christian Hardt, Kelsterbach, DE;

Jan Spengler, Breuberg, DE;

Assignee:

SIKA TECHNOLOGY AG, Baar, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G10K 11/168 (2006.01); C09J 7/38 (2018.01); C09J 11/08 (2006.01); C09J 109/00 (2006.01);
U.S. Cl.
CPC ...
G10K 11/168 (2013.01); C09J 7/38 (2018.01); C09J 11/08 (2013.01); C09J 109/00 (2013.01); C09J 2301/302 (2020.08); C09J 2301/408 (2020.08);
Abstract

An acoustic damping material includes at least one polybutadiene PB, at least one at 25° C. liquid rubber LR, at least one butyl rubber BR, at least one natural or synthetic polyisoprene PI, at least one hydrocarbon resin HR and at least one solid particulate filler FM. The acoustic damping material is suitable for use in damping of undesired vibrations and noise in mechanical structures and components of manufactured articles. The acoustic damping material is used for damping of vibrations and noise in transportation vehicles and white goods, and a vibration and noise damping element include an adhesive layer composed of the acoustic damping material, and a method for applying a vibration and noise damping element to a noise emitting surface of a substrate, and a vibration damped system include a substrate and the vibration and noise damping element bonded to a noise emitting surface of the substrate.


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