The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Sep. 12, 2023
Applicant:

Northwestern University, Evanston, IL (US);

Inventors:

Cheng Sun, Evanston, IL (US);

Rihan Hai, Evanston, IL (US);

Henry Oliver Tenadooah Ware, Evanston, IL (US);

Evan Hunter Jones, Evanston, IL (US);

Assignee:

Northwestern University, Evanston, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 13/00 (2006.01); B29D 11/00 (2006.01); G02B 7/00 (2021.01); G02B 7/02 (2021.01);
U.S. Cl.
CPC ...
G02B 13/001 (2013.01); G02B 7/003 (2013.01); G02B 7/006 (2013.01); G02B 7/022 (2013.01); G02B 7/026 (2013.01); B29D 11/00 (2013.01);
Abstract

Provided herein are methods of making imaging systems. In one aspect, the method may comprise providing a lens; providing an optomechanical assembly; providing an imaging sensor; and operably connecting the optomechanical assembly with said lens and said imaging sensor, forming said imaging system. In some aspects, providing an optomechanical assembly may comprise manufacturing a component of the optomechanical assembly using additive manufacturing. In some aspects, providing an optomechanical assembly may comprise manufacturing a component of the optomechanical assembly using micro-continuous liquid interface production (μCLIP) 3D printing.


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