The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Dec. 01, 2023
Applicant:

Semes Co., Ltd., Cheonan-si, KR;

Inventors:

Dong Seop Jung, Cheonan-si, KR;

Hark Ryong Kim, Cheonan-si, KR;

Assignee:

Semes Co., Ltd., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/31 (2006.01); G01N 21/95 (2006.01); G06T 7/73 (2017.01);
U.S. Cl.
CPC ...
G01N 21/31 (2013.01); G01N 21/9501 (2013.01); G06T 7/73 (2017.01); G06T 2207/20224 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30204 (2013.01);
Abstract

Provided is a substrate measurement method and substrate measurement control apparatus capable of greatly reducing measurement time by skipping a general identification mark recognition process, the substrate measurement method including (a) obtaining entire coordinates for an entire area of wafer by using a standard wafer, (b) aligning a measurement target wafer on a substrate stage by using at least shape features of the measurement target wafer, (c) moving a camera or the substrate stage having the measurement target wafer thereon by using the entire coordinates to position a target area of the measurement target wafer within a measurement area of the camera, and (d) measuring the target area of the measurement target wafer by using the camera.


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