The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Feb. 09, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Changhyun Park, Suwon-si, KR;
Nakhyun Kim, Suwon-si, KR;
Juyoung Kim, Suwon-si, KR;
Juwan Park, Suwon-si, KR;
Moonsun Shin, Suwon-si, KR;
Wonhee Lee, Suwon-si, KR;
Sekwan Jeong, Suwon-si, KR;
Changwoo Jung, Suwon-si, KR;
Sunghyun Chun, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 1/24 (2006.01); B01D 46/00 (2022.01); B01D 46/12 (2022.01); B01D 46/44 (2006.01); B01D 53/00 (2006.01); B01D 53/86 (2006.01); F24F 8/108 (2021.01); F24F 8/167 (2021.01); F24F 8/22 (2021.01); F24F 13/20 (2006.01); F24F 110/64 (2018.01); F24F 110/65 (2018.01); G01N 15/00 (2024.01); G01N 15/06 (2024.01);
U.S. Cl.
CPC ...
G01N 1/24 (2013.01); B01D 46/0047 (2013.01); B01D 46/12 (2013.01); B01D 46/442 (2013.01); B01D 53/007 (2013.01); B01D 53/86 (2013.01); F24F 13/20 (2013.01); G01N 15/06 (2013.01); B01D 2255/802 (2013.01); B01D 2259/804 (2013.01); B01D 2273/30 (2013.01); B01D 2279/65 (2013.01); F24F 8/108 (2021.01); F24F 8/167 (2021.01); F24F 8/22 (2021.01); F24F 2013/205 (2013.01); F24F 2110/64 (2018.01); F24F 2110/65 (2018.01); G01N 2015/0046 (2013.01);
Abstract
An air cleaner including a case comprising an upper surface and a side surface, a sensor to measure a degree of contamination of air introduced into the case, a round portion in a shape that is curved on the upper surface of the case, and a sensor air inlet on the round portion and through which air is introduced.