The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Dec. 15, 2023
Applicant:

Melexis Technologies NV, Tessenderlo, BE;

Inventors:

Ben Maes, Tessenderlo, BE;

Jian Chen, Tessenderlo, BE;

Jeroen Didden, Tessenderlo, BE;

Appo Van Der Wiel, Tessenderlo, BE;

Cathleen Rooman, Tessenderlo, BE;

Assignee:

Melexis Technologies NV, Tessenderlo, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 19/06 (2006.01); B81C 1/00 (2006.01); G01L 19/00 (2006.01); H05K 13/04 (2006.01); H10N 30/063 (2023.01); H10N 30/30 (2023.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
G01L 19/0618 (2013.01); G01L 19/0069 (2013.01); H05K 13/04 (2013.01); H10N 30/063 (2023.02); H10N 30/302 (2023.02); H10N 30/875 (2023.02); B81B 2201/0264 (2013.01); B81B 2207/012 (2013.01); B81C 1/00825 (2013.01);
Abstract

A sensor package comprises an active element with a first region and an opposite second region. The first region includes a sensing structure. The second region comprises at least one contact pad. A moulding compound encapsulates the second region and not the first region. The active element comprises at least one conductive line for routing signals from the sensing structure to the contact pad. The projection of the conductive line over the active element corresponds to a portion of the external surface of the active element. The active element comprises at least one dummy track providing a protrusion thereby raising a portion of the surface of the active element to at least the same height as the portion corresponding to the conductive line. These protrusions can receive mechanical pressure from a moulding insert applied during manufacture, relieving pressure over the portion of the surface including the conductive lines.


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