The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Sep. 21, 2022
Applicant:

Merit Medical Systems, Inc., South Jordan, UT (US);

Inventors:

Rick Russell, Cottonwood Heights, UT (US);

Jonathan Cheney, West Jordan, UT (US);

Scott Brown, Riverton, UT (US);

Luca Salmaso, Ango, CH;

Aaron Hopkinson, Herriman, UT (US);

Assignee:

Merit Medical Systems, Inc., South Jordan, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/08 (2021.01); G01D 11/24 (2006.01);
U.S. Cl.
CPC ...
G01K 1/08 (2013.01); G01D 11/245 (2013.01);
Abstract

A molded sensor assembly for measuring parameters in a given circumstance. The molded sensor assembly includes a housing with one or more apertures that extends from an upper surface to a lower surface of the housing. A lower surface of the housing is coupled to an upper surface of a printed circuit board member. A sensor is disposed within the housing, the sensor comprising wires that are coupled to the printed circuit board member. Each wire extends through an aperture of the housing.


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