The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Oct. 27, 2023
GE Infrastructure Technology Llc, Greenville, SC (US);
Evan John Dozier, Greenville, SC (US);
Nathan Nicholas Ostrout, Greenville, SC (US);
Jacob Andrew Salm, Simpsonville, SC (US);
Mark Lawrence Hunt, Greenville, SC (US);
Stanley Frank Simpson, Greenville, SC (US);
James Warren Pemrick, Troy, NY (US);
GE Infrastructure Technology LLC, Greenville, SC (US);
Abstract
A component including a body, and an additively manufactured (AM) metal coupon including a first section and a stress-relief section, is disclosed. The stress-relief section includes a porous region having a porosity between 2% to 50% open space volume to total volume of the stress-relief section. The stress-relief section has at least one of thermal conductivity, tensile strength, ductility, or fatigue strength less than first section. A braze material couples the AM metal coupon to a coupon opening in the body. The stress-relief section creates a low-stress zone in the metal coupon that can be located near or adjacent to a high-stress zone. The stress-relief section reduces residual stress in the metal coupon, which reduces the related challenges of coupling the metal coupon to the body of the component, especially where superalloy materials are used.