The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Dec. 27, 2023
Seiko Epson Corporation, Tokyo, JP;
Setsuya Iwashita, Nirasaki, JP;
Tetsuhiko Takeuchi, Shimosuwa, JP;
Yasutoshi Hideshima, Matsumoto, JP;
Fumiya Maeda, Matsumoto, JP;
Shunsuke Uchizono, Shiojiri, JP;
Koichi Ozaki, Okayama, JP;
Tadao Fukuta, Kurashiki, JP;
SEIKO EPSON CORPORATION, , JP;
Abstract
A thixotropic molding material includes: a metal body containing Mg as a main component; AlN particles adhering to a surface of the metal body and containing AlN as a main component; and silica particles interposed between the metal body and the AlN particles, having an average particle diameter smaller than an average particle diameter of the AlN particles, and containing a silicon oxide as a main component. A mass fraction of the AlN particles in a total mass of the metal body and the AlN particles is 3.0% or more and 30.0% or less.