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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12735570 B1

PDFFull Text
Date of Patent:
Sep. 15, 2026

Filed:

Dec. 28, 2020

Multilayer body and electronic component formed of same

Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventors:

Shinichi Yamamoto, Ichihara, JP;

Ryosuke Yamazaki, Ichihara, JP;

Shin Yoshida, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:

Warner Norcross + Judd LLP

Primary Examiner:

Kevin R Kruer

Int. Cl.
CPC ...
C08L 83/04 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 25/04 (2006.01); B32B 25/20 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); C09J 7/29 (2018.01); C09J 183/04 (2006.01); B32B 15/06 (2006.01); B32B 15/20 (2006.01); B32B 17/06 (2006.01); B32B 25/08 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 25/042 (2013.01); B32B 25/20 (2013.01); B32B 37/06 (2013.01); B32B 37/1018 (2013.01); C09J 7/29 (2018.01); C09J 183/04 (2013.01); B32B 15/06 (2013.01); B32B 15/20 (2013.01); B32B 17/063 (2013.01); B32B 25/08 (2013.01); B32B 27/365 (2013.01); B32B 2307/202 (2013.01); B32B 2307/536 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/748 (2013.01); B32B 2457/00 (2013.01);
Abstract

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa·s or less.

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