The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Dec. 14, 2021
Dow Toray Co., Ltd., Tokyo, JP;
Ryosuke Yamazaki, Ichihara, JP;
Shinichi Yamamoto, Ichihara, JP;
Kouichi Ozaki, Ichihara, JP;
Toru Imaizumi, Ichihara, JP;
DOW TORAY CO., LTD., Tokyo, JP;
Abstract
Provided is a hot-melt curable silicone composition with excellent hot dispensing properties and storage stability, which can be cured by triggering an external energy stimulus, and which provides excellent adhesive and mechanical properties to the cured product, and applications thereof. A curable silicone composition, including in a specific mass % range, comprises: (A) a non-hot-melt solid organopolysiloxane resin mixture; (B) a linear organopolysiloxane that is liquid at 25° C. having the same curing reactive functional group; (C) an organohydrogen polysiloxane; and (D) a hydrosilylation reaction catalyst that is inert at room temperature but is activated by an external energy stimulus. The whole composition has hot-melt properties, and the melt viscosity (flow tester measurement) at 100° C. is 50 Pa·s or less. A cured product thereof, and use in semiconductor applications and the like, is also provided. The composition is particularly suitable for use as an adhesive or sealing agent in hot dispensing applications.