The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Oct. 26, 2021
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/10 (2006.01); B32B 7/12 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
B32B 17/10458 (2013.01); B32B 7/12 (2013.01); B32B 17/10018 (2013.01); B32B 38/10 (2013.01); B32B 43/003 (2013.01); B32B 2250/02 (2013.01); B32B 2307/7376 (2023.05);
Abstract
The present multi-layered structure includes: a resin layer; a glass layer stacked via an adhesive layer on the resin layer; and a fusion layer that is formed in an outer peripheral portion of the glass layer on the glass layer side that faces the adhesive layer. A thickness of the glass layer is 10 μm or more and 300 μm or less. A thickness of the fusion layer is less than 3 μm.