The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Jun. 21, 2022
Applicant:

The Boeing Company, Chicago, IL (US);

Inventor:

Perry T. Horst, Tacoma, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29L 7/00 (2006.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); G06F 30/17 (2020.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); G06F 30/17 (2020.01); B29L 2007/002 (2013.01);
Abstract

In an example, systems and methods for modeling apertures for additive manufacturing is disclosed. In an example, a computing device includes a processor configured to carry out operations. The operations include generating a computational model of a three-dimensional structure. The three-dimensional structure includes a first group of slats including a first plurality of slats substantially parallel to each other along a first axis and a second group of slats comprising a second plurality of slats substantially parallel to each other along a second axis, wherein the second group of slats intersects the first group of slats. The operations include outputting instructions for manufacturing a substrate in accordance with the generated computation model of the three-dimensional structure. The system includes an additive manufacturing apparatus communicatively coupled to the computing device and configured to receive the instructions and manufacture the substrate in accordance with the generated computation model of the three-dimensional structure.


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