The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2026

Filed:

Apr. 16, 2025
Applicant:

Sumitomo Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Yuta Nesaki, Chiba, JP;

Yasuo Suzuki, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/73 (2006.01); B29C 45/17 (2006.01); B29C 45/27 (2006.01); B29C 45/46 (2006.01);
U.S. Cl.
CPC ...
B29C 45/46 (2013.01); B29C 45/1742 (2013.01); B29C 45/27 (2013.01); B29C 45/73 (2013.01); B29C 45/7312 (2013.01);
Abstract

A mold device includes a fixed mold and a movable mold. Cavity space is formed between the molds when clamped together. The fixed mold includes: a first mold piece that, upon clamping of the molds, contacts the movable mold and forms part of a wall surface of the cavity space; a first cooling part adjusted to lower temperature than the first mold piece; and a first support part movably supporting one of the first cooling part and the first mold piece relative to the other one. The movable mold includes: a second mold piece that, upon clamping of the molds, contacts the fixed mold and forms part of the wall surface; a second cooling part adjusted to lower temperature than the second mold piece; and a second support part movably supporting one of the second cooling part and the second mold piece relative to the other one.


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