The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Aug. 15, 2022
Kasai Kogyo Co., Ltd., Kanagawa, JP;
Nobuaki Seki, Atsugi, JP;
KASAI KOGYO CO., LTD., Kanagawa, JP;
Abstract
A molding die includes: a first mold formed of a steel material, the first mold including a first front surface serving as a contact surface that comes into contact with a molded product, a fine hole penetrating from the first front surface, and a plated layer formed on the first front surface and an inner wall of the fine hole; and a second mold configured to be combined with the first mold, the second mold including a second front surface that faces the first front surface to define a space between the first front surface and the second front surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile