The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
May. 04, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kyung Don Mun, Suwon-si, KR;
Sang Cheon Park, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package includes a buffer die, semiconductor chip stacks stacked on the buffer die, each of the semiconductor chip stacks including a plurality of first semiconductor chips and a second semiconductor chip on the plurality of first semiconductor chips, and a mold layer covering an upper surface of the buffer die and side surfaces of the semiconductor chip stacks. Each of the first semiconductor chips and the second semiconductor chip includes a wiring part including multilayer wirings, an upper connection structure on the wiring part and having a plurality of upper conductive pads and a lower connection structure under the wiring part and having a plurality of lower conductive pads, and the second semiconductor chip further includes a redistribution layer on the upper connection structure and having an insulating layer and a plurality of redistribution pads in the insulating layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile