The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Mar. 04, 2022
Applicant:
Atotech Deutschland Gmbh & Co. KG, Berlin, DE;
Inventor:
Ralf Schmidt, Berlin, DE;
Assignee:
Atotech Deutschland Gmbh & Co. KG, Berlin, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H10W 72/00 (2026.01); H10W 72/90 (2026.01); H10W 99/00 (2026.01); H10W 80/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 72/90 (2026.01); H10W 72/019 (2026.01); H10W 99/00 (2026.01); H10W 72/01935 (2026.01); H10W 72/952 (2026.01); H10W 80/312 (2026.01); H10W 80/327 (2026.01); H10W 90/792 (2026.01);
Abstract
The invention relates to method for copper-to-copper direct bonding comprising the steps:
Schmidt, Ralf. (2026). Method for copper-to-copper direct bonding and assembly (U.S. Patent No. 12733531). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12733531
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile