The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Jan. 08, 2024
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Yan-Tang Dai, Miao-Li County, TW;

Tzu-Min Yan, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); H10K 59/82 (2023.01); H10W 70/60 (2026.01); H10W 70/65 (2026.01); H10K 59/95 (2023.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H05K 1/0298 (2013.01); H05K 3/027 (2013.01); H05K 3/064 (2013.01); H10K 59/82 (2023.02); H10W 70/611 (2026.01); H05K 2201/09281 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/107 (2013.01); H10K 59/95 (2023.02); H10W 90/00 (2026.01);
Abstract

The disclosure discloses a manufacturing method of an electronic device, which comprises the following steps: providing a first substrate, providing a second substrate, bonding the first substrate and the second substrate through an adhesive layer, forming a conductive layer on the side surfaces of the first substrate, the second substrate and the adhesive layer, performing a first patterning process on a first region of the conductive layer, and performing a second patterning process on a second region of the conductive layer, the first region at least partially overlaps the adhesive layer, and the second region overlaps the side surfaces of the first substrate and the second substrate, and the first patterning process is different from the second patterning process.


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