The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2026

Filed:

Nov. 23, 2022
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Keitaro Ichikawa, Tokyo, JP;

Yuji Shikasho, Tokyo, JP;

Takuya Sakamoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 70/40 (2026.01); H10W 70/04 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 70/429 (2026.01); H10W 70/048 (2026.01); H10W 74/016 (2026.01); H10W 74/111 (2026.01);
Abstract

A semiconductor device includes a sealing resin being an insulating resin sealing the semiconductor element therein, and a plurality of electrode terminals each including a root portion being a root protruding from the sealing resin, a tip portion being a tip and portion extending from the root portion, and a middle portion provided between the tip portion and the root portion, and the middle portion includes first middle portions having a width wider than those of the root portion and the tip portion in the first direction, and a second middle portion having a width wider than those of the root portion and the tip portion in the first direction, a width narrower than those of the first middle portions in the first direction, and a bent portion bent toward in a third direction orthogonal to the first direction and the second direction.


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